Téléchargez le livre : 3D Microelectronic Packaging

3D Microelectronic Packaging

From Architectures to Applications de

,

Éditeur :

Springer


Collection :

Springer Series in Advanced Microelectronics

Paru le : 2020-11-23

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Description


This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.  
Pages
622 pages
Collection
Springer Series in Advanced Microelectronics
Parution
2020-11-23
Marque
Springer
EAN papier
9789811570896
EAN PDF
9789811570902
Informations sur l'ebook
Nombre pages copiables
6
Nombre pages imprimables
62
Taille du fichier
36516 Ko
Prix
168,79 €
EAN EPUB
9789811570902
Informations sur l'ebook
Nombre pages copiables
6
Nombre pages imprimables
62
Taille du fichier
219290 Ko
Prix
168,79 €

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