Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

EPITS 2022, 14-15 September, Langkawi, Malaysia de

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Éditeur :

Springer


Collection :

Springer Proceedings in Physics

Paru le : 2023-07-02

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Description

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th  and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ?
Pages
875 pages
Collection
Springer Proceedings in Physics
Parution
2023-07-02
Marque
Springer
EAN papier
9789811992667
EAN PDF
9789811992674

Informations sur l'ebook
Nombre pages copiables
8
Nombre pages imprimables
87
Taille du fichier
32092 Ko
Prix
126,59 €
EAN EPUB
9789811992674

Informations sur l'ebook
Nombre pages copiables
8
Nombre pages imprimables
87
Taille du fichier
186829 Ko
Prix
126,59 €