Téléchargez le livre : Characterization of Integrated Circuit Packaging Materials

Characterization of Integrated Circuit Packaging Materials

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Newnes


Paru le : 2013-10-22

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Description
Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.
Pages
274 pages
Collection
n.c
Parution
2013-10-22
Marque
Newnes
EAN papier
9780750692670
EAN PDF SANS DRM
9781483292342
Informations sur l'ebook
Prix
57,97 €

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