Téléchargez le livre : 3D Microelectronic Packaging

3D Microelectronic Packaging

From Fundamentals to Applications de

,

Éditeur :

Springer


Collection :

Springer Series in Advanced Microelectronics

Paru le : 2017-01-20

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Description
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. 
Pages
463 pages
Collection
Springer Series in Advanced Microelectronics
Parution
2017-01-20
Marque
Springer
EAN papier
9783319445847
EAN PDF
9783319445861
Informations sur l'ebook
Nombre pages copiables
4
Nombre pages imprimables
46
Taille du fichier
21473 Ko
Prix
179,34 €
EAN EPUB
9783319445861
Informations sur l'ebook
Nombre pages copiables
4
Nombre pages imprimables
46
Taille du fichier
13353 Ko
Prix
179,34 €

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