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Télécharger le livre : Wafer Level 3-D ICs Process Technology
Ronald J. Gutmann , L. Rafael Reif , Chuan Seng Tan
Wafer Level 3-D ICs Process Technology
Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system...
Editeur : Springer
Parution : 2009-06-29
Collection : Integrated Circuits and Systems
Format(s) : ePub
147,69 €
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Télécharger le livre : Chemical Mechanical Planarization of Microelectronic Materials
Ronald J. Gutmann , Shyam P. Murarka , Joseph M. Steigerwald
Chemical Mechanical Planarization of Microelectronic Materials
Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative...
Editeur : Wiley-VCH
Parution : 2008-09-26

Format(s) : PDF
174,02 €
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